Custom Automation
Designed for high-speed cable core preparation, integrating UV laser aluminum foil stripping, foil removal, CO₂ laser dielectric stripping, dielectric removal, wire pre-forming, final forming and trimming. Adaptation to different high-speed cable types is based on their structures and processing requirements.
Industry Focus
High-speed cable processing and cable assembly manufacturing.
Applicable Products
MCIO and other high-speed cables requiring foil and dielectric processing and core forming, subject to cable structure and process requirements.
Line Compatibility
Semi-automatic cable core preparation equipment with manual wire-clamp loading and fixture-based process transfer.
| Item | Specification |
|---|---|
| UV Laser | Dual-head laser; water-cooled |
| CO₂ Laser | Dual-head laser; air-cooled |
| Laser Processing Repeatability | 0.01 mm |
| Foil / Dielectric Displacement Module Repeatability | 0.02 mm |
| Module Processing Range | 90 mm |
| Cycle Time | Approx. 12 s/pc (single wire clamp; estimated) |
| Air Pressure | 0.5–0.7 MPa |
| Input Voltage | 220 V |
| Main Equipment Length | Approx. 1,600 mm |
| Overall Reference Layout Dimensions |
3,600 × 1,100 × 1,900 mm (L × W × H), including two manual worktables |
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