Fully Automatic CDFP Cable Preparing Line
Integrating multi-station UV/CO2 laser stripping and automatic soldering — delivering highly integrated CDFP cable processing with real-time traceability and MES connectivity.
Integrating multi-station UV/CO2 laser stripping and automatic soldering — delivering highly integrated CDFP cable processing with real-time traceability and MES connectivity.
Dual-station flexible design for MCIO high-speed cables — laser stripping, aluminum foil processing, and Hot Bar soldering, with ≤25s CT, 97% yield, and 24/7 stable operation.
Integrates wafer assembly, laser welding, and shielding assembly — delivering ±0.01mm precision and 97% yield for NearStack 100Ω connectors and cable assemblies.
Non-contact CO₂ laser processing for precision cutting and stripping of high-speed cable insulation and other dielectric materials.
UV/CO2 laser stripping and Hot Bar soldering for CDFP cables — delivering 135–140 pcs/h with closed-loop servo, vision inspection, and MES integration.
Combining pulsed heating, precision temperature control and dual soldering modules for efficient hot bar soldering of PCB assemblies.
Simulated mechanical foil handling and automatic removal of surface aluminum foil and dielectric layers in cable processing.
Combining XYZ-axis positioning and flexible dispensing valve options for precision dispensing of UV-curable adhesives and solder paste.
Integrating 3D vision positioning and dual-station soldering for precise alignment and joining of conductors to pre-tinned PCB pads. 3D Vision-Guided Positioning Adaptive Soldering Alignment Dual-Station Soldering
The Desktop Conductor Trimming & Forming Machine is designed for precision trimming, pre-forming, and final forming of conductors in high-speed cables.
Dual-gantry, dual-station solder ball jetting machine with non-contact thermal control for micro-solder applications — ±0.005mm vision positioning and ±0.03mm XYZ accuracy.
Designed for high-speed cables and connector assemblies, using laser welding technology for precision joining.
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