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Connector Automation

Fully Automatic OSFP Connector Assembly, Inspection & Packaging Line

This line is engineered for high-speed board-to-board connectors, integrating a complete set of precision processes, including carrier strip welding, cutting, tie bar cutting, shielding plate soldering, Wafer bending, automated assembly of four wafer types, as well as finished product testing and packaging. Delivering end-to-end automation from raw materials to final packaging, this line serves as a high-efficiency, ultra-precise smart manufacturing solution for the high-speed connector industry.

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Product Introduction

Application Scenarios

Industry Focus

Widely applied in optical communications, data centers, AI computing infrastructure, and other related fields.

Applicable Products

Specifically customized for the automated assembly of high-speed connectors used in cloud computing, servers, and telecommunications.

Core Advantages

  • Precision Stamping: Precision dies for stamping carrier strip ensure high accuracy.
  • Precision Assembly: High-precision positioning and assembly, featuring a secondary re-pressing function with adjustable parameters.
  • Accurate Inspection: Multi-point inspection combining electrical testing and machine vision to rigorously screen out defective parts.
  • Quality Assurance: High-precision positioning guarantees dimensional stability and significantly reduces material waste.
  • Operation, Maintenance & Training: Safe operation, easy maintenance, intuitive UI, and low training costs.

Technical Specifications

Item Specification
Wafer Cutting, Bending & Soldering Line 19,500 mm*1,200 mm*1,900 mm
Automatic Finished Product Assembly Machine 10,000 mm*1,300 mm*1,900 mm
Automatic Final Assembly Machine 5,000 mm*1,200 mm*1,900 mm
CT ≤ 3 s
UPH 1,080 pcs/h
Yield ≥ 99%
OEE ≥ 85%

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