Fully Automatic CDFP Cable Preparing Line
Integrating multi-station UV/CO2 laser stripping and automatic soldering — delivering highly integrated CDFP cable processing with real-time traceability and MES connectivity.
Integrating multi-station UV/CO2 laser stripping and automatic soldering — delivering highly integrated CDFP cable processing with real-time traceability and MES connectivity.
Integrates multi-in-one appearance, dimension, and tightness inspection with unmanned tray loading — delivering 0.8 s CT and 99% yield.
Integrates multi-rotor Maglev transport and multi-point synchronous spot welding for Ring & Nut assembly — delivering 1 s CT and 99% yield.
Integrates multi-rotor Maglev transport and patented cutting-transfer for Type-C connector assembly — delivering 0.8s CT and 99% yield.
Integrates patented cutting-transfer, rotary alignment, and spot welding for Type-C MP/IM/EMI assembly — delivering 0.8s CT and 99% yield.
Fully automatic assembly and inspection line for ExaMAX2 high-speed backplane connectors. Integrates cam-driven pin insertion with high-precision vision systems for 30-minute changeovers and ≥99% yield.
Integrates terminal insert molding, Bridge assembly, hot riveting, and AOI inspection for TWS charging case connectors — CT < 1.3s and ±0.02mm assembly tolerance.
Integrates CNC & MESH, CNC & CONTACT, and Frame assembly with vision-guided processes and zero-downtime changeover for TWS charging case plug connectors — ±0.01mm assembly accuracy and 0.8s assembly CT.
Laser rotary aluminum foil cutting, vision inspection, and full electrical testing for RT-version Ethernet cables — FPY ≥ 99%, up to 900 UPH, CT ≤ 8s.
Dual-station flexible design for MCIO high-speed cables — laser stripping, aluminum foil processing, and Hot Bar soldering, with ≤25s CT, 97% yield, and 24/7 stable operation.
Integrates wafer assembly, laser welding, and shielding assembly — delivering ±0.01mm precision and 97% yield for NearStack 100Ω connectors and cable assemblies.
Integrates wafer assembly, resistance welding, and high-pressure molding for Impel connectors — delivering ±0.01mm precision, ≤15s CT, and 97% yield.
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